直播時(shí)間：2023年4月14日（周五）20:00-21:30
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北京時(shí)間2023年4月14日晚八點(diǎn)，iCANX Talks 第139期將在iCANX平臺(tái)上線！本期我們邀請(qǐng)到清華大學(xué)馮雪教授進(jìn)行分享！更多精彩，敬請(qǐng)期待！
【直播介紹】
Xue Feng
Tsinghua University
Flexible integrated circuits: design, manufacture and applications
【Abstract】
Flexible electronics technology refers to the integration of different materials and functional units on flexible substrates to form thin, flexible, deformable and reconfigurable electronic devices/systems. It subversively changes the rigid physical form of traditional electronic devices. The core of flexible electronics technology is the design, manufacture and reliability of flexible integrated devices.
柔性電子技術(shù)是指將不同的材料和功能單元集成在柔性襯底上，形成輕薄柔小、可變形、可重構(gòu)的電子器件/系統(tǒng)。它顛覆性地改變了傳統(tǒng)電子器件剛性的物理形態(tài)。柔性電子技術(shù)的核心是柔性集成器件的設(shè)計(jì)、制造及可靠性。
This talk firstly introduces the design theory and manufacture of flexible integrated devices, including the evolution mechanism of semiconductor properties under deformation and the integration method of transfer printing on heterogeneous interfaces. For wafer level manufacturing of flexible integrated devices, nanometer diamond enhanced wafer grinding method is used, which can thin 4-12 inch wafer to 25 microns. With ultra-thin chips transfer and high energy laser beam slicing, the single flexible chips with independent function are obtained.
本次演講首先介紹了柔性集成器件設(shè)計(jì)理論和方法，包括形變下半導(dǎo)體性能演化機(jī)理、異質(zhì)界面轉(zhuǎn)印集成方法等。針對(duì)柔性集成器件的晶圓級(jí)制造，采用了納米金剛石強(qiáng)化晶圓研磨法，可將4～12英寸晶圓薄化到25微米，進(jìn)行超薄晶圓轉(zhuǎn)移和高能激光束劃片，得到具有獨(dú)立功能的單個(gè)柔性芯片。
Then the flexible chips are picked up, transferred, interconnected, encapsulated and integrated, and finally the flexible integrated devices are formed. The first small test line of flexible integrated device manufacturing domestic and abroad and the CNAS standard testing and certification system have been established, and ultra-thin flexible chips, high-density packaging of flexible chips, high-precision SMT of flexible circuit boards and low-temperature silicone injection encapsulation have been realized from chip level to module level manufacturing. The above technologies greatly promote the innovation and development of flexible integrated devices and their applications in health care, intelligent perception, major equipment and other fields.
隨后進(jìn)行柔性芯片拾取、轉(zhuǎn)移、互連、封裝和集成，最終形成柔性集成器件。建立了國(guó)際國(guó)內(nèi)首條柔性集成器件制造小試線和CNAS標(biāo)準(zhǔn)檢測(cè)認(rèn)證體系，實(shí)現(xiàn)超薄柔性芯片、柔性芯片高密度封裝、柔性電路板高精度SMT和低溫硅膠注塑包封等從芯片級(jí)到模組級(jí)制造。以上技術(shù)極大推進(jìn)了柔性集成器件的創(chuàng)新發(fā)展及其在健康醫(yī)療、智能感知、重大裝備等領(lǐng)域的應(yīng)用。
【BIOGRAPHY】
Xue Feng, male, born in 1977, Professor of Tsinghua University, 973 Project Chief Scientist, currently director of Flexible Electronic Technology Laboratory of Tsinghua University, President of Zhejiang Tsinghua Flexible Electronic Technology Research Institute, etc.
馮雪，男，1977年生，清華大學(xué)長(zhǎng)聘教授，國(guó)家973首席科學(xué)家、國(guó)家杰青等，現(xiàn)任清華大學(xué)柔性電子技術(shù)實(shí)驗(yàn)室主任、浙江清華柔性電子技術(shù)研究院院長(zhǎng)等。
Professor Feng Xue is committed to solid mechanics and flexible electronics technology. So far, he has published more than 260 SCI papers in Nat. Mater., Sci. Adv., Adv Mater. More than 190 national invention patents and 9 software Copyrights were authorized. He has won the Heliang Heli Foundation Science and Technology Innovation Award, China Youth Science and Technology Award, National Outstanding Scientist of Science and Technology, Qiushi Outstanding Youth Award of China Association for Science and Technology, etc. Ranked in 1st, he has won the first prize of Beijing Natural Science, the first prize of Technology Invention of the Ministry of Education and many other awards.
馮雪教授致力于固體力學(xué)與柔性電子技術(shù)研究，至今在Nat. Mater.、Sci. Adv.、Adv. Mater.、Natl. Sci. Rev.、JMPS等已發(fā)表SCI論文260余篇；授權(quán)國(guó)家發(fā)明專利190余項(xiàng)、自主軟件著作權(quán)9項(xiàng)；曾獲何梁何利基金科學(xué)與技術(shù)創(chuàng)新獎(jiǎng)、中國(guó)青年科技獎(jiǎng)、全國(guó)優(yōu)秀科技工作者、中國(guó)科協(xié)求是杰出青年獎(jiǎng)等，以第一完成人獲北京市自然科學(xué)一等獎(jiǎng)、教育部技術(shù)發(fā)明一等獎(jiǎng)等獎(jiǎng)等多項(xiàng)省部級(jí)和學(xué)會(huì)獎(jiǎng)勵(lì)。
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